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The electroplating of the magnetic connector is mainly the electroplating of the conductor part, such as PIN pin, wire terminal, grounding piece, etc. The main function of electroplating is to prevent oxidation of the surface of the conductor, improve corrosion resistance and protection performance.
Electroplating is to immerse an electroplated piece (product) in a syrup containing metal ions to be plated, and turn on the cathode. The other end of the syrup is placed on a suitable anode (soluble or insoluble). After passing through the direct current, the plated part is plated. The surface is a method of depositing a metal film.
Common plating materials:
Nickel plating: For bottoming, improve corrosion resistance, thickness is commonly used 50u" Min. Tin plating: Improve welding ability, divided into 2 kinds of tin: bright tin and fog tin. Bright tin is not resistant to high temperature, suitable for DIP products; Tin high temperature resistance, suitable for SMT products. Gold plating: improve the conductive contact resistance, improve signal transmission, high cost, generally with selective plating gold.
The plating method has two methods: first punching and first plating and first plating. The first plating is usually used for the plating of the terminal terminals.
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